Glossary of Terms
13,56 MHz, 2,45 GHz, 27,12 MHz, 40 kHz
Ablation, ABS, ABS Acrylnitril-Butadien-Styrol, Absorbing, Absorption, Accessories, Acetone, Acid, Acryl, Acrylic Resin, Activation, Activating, Active Species, Adherence, Adhesion, Adhesion Improvement, Adhesion of lacquer, Adhesive agent, Adhesive strength, Adsorbing, Adsorption, Advanced Composite, AFM, Aggregate Phase, Air Plasma, Aluminium, Aluminium painting, Aluminium cleaning, Aluminium Oxide, amphiphile, amorphous, Anion, Anisotrop, anisotrop, Anode, anodic Bonding, Anti Finger Print, anti adhesive, antiadhesive Coatings, anti septic cleaning, Applications of plasma, Aqueous dye, Argon (Ar), Argon plasma, aromatic, Aromaticity, Asbestos, Asbestos Analysis, Ashing, Aspect Ratio, Atmosphere, Atmospheric Pressure, Atmospheric Pressure Plasma, Atmospheric Plasma, Atom, Atomic Force Microscopy AFM, Auger Effect, Automotive Painting, Automation, Automotive Engineering
Band Gap, Barrel Plasma Etcher, Barrel Reactor, Barriere Layers, Base material for printed circuit boards, Benzene, Bias Voltage, Binding energy, Blown Film, Blend, Blocking, Bonding agent, Bonding Glas, Bonding Wire, Borosilicate Glass
carbon, carbon fibre, catheter, cathode, cation, caoutchouc, CDE, ceramics, CF4, Chamber, Charcoal, Charge Exchange Collision, Chemical Reaction, Chemisches Etching, Chemisorption, Chip, chip packaging, Chromium, Chromium Sulfur Acid, Circuit Board, Circuit Path, Cleaning Aluminium, cleaning copper, Cleanroom, Coating, Coating Method, Coating of Plastics, Coating PTFE, Coating technique, COC, cohesion, Coil-Coating, Cold plasma, Colour of plasma, Composite, Contact angle, Copolymer, Copper, Copper cleaning, Corona, Corona Discharge, Corona Treatment, Corrosion, Corrosion protective, Coupling agent, covalent binding, cratering, Cross Cut Test, Cross Cut Tape Test, Crystal, CVD, CVD Coating, Cyclo-Olefin-Copolymer
DBD, Depolymerisation, Disinfection, decreasing contact angle, decreasing surface tension, deep drawing, desmear, Desmear Process, desmearing, Desorption, Diamond Like Carbon, die bonding, Dielectric barrier discharge, Diffusion layer, Dirting, DLC, DLC coating, dotieren, downstream plasma, downstream reactor, DRIE, dry, dryasher, drycleaner, dryetcher, dry etching, dryoven, Duplex Surface Engineering
Easy to clean, Electrode, Electron, Electronegative Plasma, Electron Microscope, Electron Volt, Electronic Control, Electroplating of plastics, Electropositive Plasma, Electric Arc, Elektrostatische Aufladung, Elongation, Embrittlement, EPDM, EPM, Etching, Etching Circuit Boards, Etching Glas, Etching Mask, Etching PTFE, Etching Teflon, Ethylen-Propylen-(Dien)-Copolymer, EPDM-profile, Epilam Layer, Epilam Coating, Epitaxy, Epoxy Resin, Epoxide, ESCA, Exhaust
Faraday, Fatigue strength, Fibre reinforced composites, Film, Film treatment, Finish, Flake Off, Flame Treatment, Flanges, Flocking, Fluor, Fluxing agent, Foto resist, Foto resist ashing, Fotolithography, Fotoresist, Functionalization
Gallium Arsenid, Gallium-Arsenid, Galliumarsenid, Gas charge, Gas, Gas discharge, Gas flow, Gas supply, GDOS, Generator, GHz Plasma System, Glas, Glas etching, Glas Bonding, Glas fibres, Glass Transition Temperature, Glow, Glueing, Glue, Graphen, Graft Polymerisation, Ground state,
Hard material coats, Hexamethyldisiloxane, HF-Generator, HMDSO, HMDSO coating, high-puridity surfaces, High Voltage, High Voltage Discharge, High Voltage Generator, Hydrocarbon, Hydrogene, Hydrogene plasma, hydrophil, Hydrophile Surface, Hydrophob, Hydrophobe Surface, hydrophobic
IC, ICP (inductively coupled plasma), Impregnation, Improving Adhesion, Improving Lacquer Adhesion, increasing contact angle, Induction, Inductive Plasma, Inert Gas, Increase Surface Tension, Increase Wetting, Interface Energy, Ion, Ion density, Ion etching, Ion binding, Ion Implantation, Ion Plating, Ion Beam Etching, Ion Measuring Sensor, Ionisation, Iron, ISM, Isotope, isotrope
Lab-on-Chip, LABS, LABS-Test, Lacquer, Lacquer adhesion, Langmuir Probe, Layer thickness, LCP Liquid Crystal Polymers, Leadframe, Lightning Discharge, LIGA, LIGA Process, lipophilic, lipophobic, Lithography, LOC, Low Pressure Plasma, Low Pressure Plasma System, Low Pressure Plasma Technoloy, Low Temperature Plasma, Low Temperature Plasma System, Lubricant Coating
Magazin, Magnetic Mirror, Magnetron, Magnetventil, Mask, MEMS, Metal, Metallising, MFC / Mass-Flow-Controller, MHz Plasma System, Microchip, Micro Fluidics, Micro Plasma, Micro Sandblasting, Micro system Technology, Micro Technology, Microwell, Microwave Plasma, Microwave Technology, Mean free waypath, Modification, modified surface, modifying surface tension, molecule, Monolitic Integrated Circuit, Monomer, Multilayer, Mumetall
Needle Valve, Nano-Technology, Negativ Resist, Neon lamp, Neutron, Nukleon
O-Rings, O-Ring-Coating, Object slides, open plasma, open air plasma, Optical Coating, Overetching, Oxidation, oxidizing, Oxygene
PA Polyamid, PACVD, Painting Aluminium, Painting Plastic, Painting Procedures, PAN Polyacrylnitril, Planar Reactor, Parylene, PB Polybuten, PC Polycarbonat, PCB, PDMS, PE Polyethylen, PECVD, Peeling, Perfluoralcoxyl-PFA, Permeation, PET Polyethylenterepthalat, PFA Perfluoralcoxyl, Photon, Photoresist, Physical Etching, Physisorption, Pirani-Sensor, Plasma, Plasma activation, Plasma applications, Plasmaasher, Plasmabeam, Plasma boriding, Plasma carbonitriding, Plasma carborising, Plasma chamber, Plasma chemistry, Plasma cleaner, Plasmacleaner, Plasma cleaning, Plasma coating, Plasma control, Plasma density, Plasma etcher, Plasma etching, Plasma diffusion, Plasma effects, Plasma generation, Plasma high-puridity cleaning, Plasma modification, Plasma nitriding, Plasma nitrocarburising, Plasma oven, Plasma polymerisation, Plasma process, Plasma sandblasting, Plasma spraying, Plasma spray coating, Plasma stripper, Plasma system, Plasma System Components, Plasma technique, Plasma technology, Plasma treatment, Plasma unit, Plastic, Plastic Activation, Plastic Coating, Plastic Painting, Plastic surfaces, Polarity, Polymer, Polymerisation, Polyamid (PA), Polybutylen terephthalate (PBT), Polycarbonat (PC), Polydimethyl siloxane, Polyethylene terephthalate (PET), Polymethacrylimide (PMI), Polyolefine, Polyoxymethylene (POM), Polymethyl methacrylate (PMMA), Polypropylene (PP), Polystryrol (PS), Polytetrafluorethylene (PTFE), Polyvinyl fluoride (PVF), Polyvinylidene fluoride (PVDF), Positive column, Positiv resist, Powder Coating, PP Polypropylene, PPS Polyphenylene sulfide, Precursor, Primer, Printing, Proton, Process gas, Process time, Protective layer, PTFE etching, PTFE coating, PTFE, PUR, Polyurethane, PVC, Polyvinyl chloride, PVD, PVD process, PVDF Polyvinylidene fluoride, PVF Polyvinyl fluoride
Radicals, Reactive Ion Etching, Reactive Ion Plating (RIP), Reduce wetting, Reduction (chemistry), Redox, Recombination, Recipient, Release agent, Removing silicones, RIE, Roll-to-roll, Roots pump, Rotary drum, Rotary Vane Pump, Rubber
Scanning electron Microscopy, sccm, Scratch Resistance, Seal, Self-Bias, Semi automatic, Semiconductor, Semiconductor Chip, Sensitivity, Silan, Silicon, Silicon carbide, Silicon dioxide, Silicone, Silicon nitride, Silicone removing, Silicon wafer, Silicon Chip, Silicone free, Silicone cleaner, Silk Print, SIMS, Siloxane, Silver, slm, SMD (Surface Mounted Devices) technology, Soldering, Sputtering system, Sputtering, Stainless Steel, Sterilization, Stimulation, Sulfur hexafluoride, Super hydrophobe, Supply Unit, Surface Activation, Surface Cleaning, Surface Coating, Surface Energy, Surface Modification, Surface Oxide, Surface Technique, Surface Tension, Surface Treatment, Surgery, synthetic fibres
Target, Tear test. Teflon, Teflon etching, Teflon printing, Teflon painting, TEM, Tenside, Tesla, Test ink, Tetrafluormethan, Textil treatment, Thermoforming, Thin film technology, Thornton-Diagramm, Titanium carbide, Titanium nitride, TOF-SIMS, TMMF, TPA Thermoplastic Polyamide-Elastomere, TPE Thermoplastic Elastomere, Turbomolecular ultra high vacuum pump
UHP, Ultra high puridity, Ultra high vacuum, ultra hydrophobic, Ultraviolett, Undercutting, UV-Radiation
Vacuum, Vacuum Plasma Spraying, Vacuum chamber, Vacuum pumps, Valence, Valence electrons, Van-der-Waals-forces, Vapor Deposition, varnish, varnishing
Wafer, Wafer etcher, washable, Wearout, Wetting, Wetting increase, Wetting reduce, Wetting Test, Wire Bonding